CyberOptics 3D.2D Inspection & Measurement
- Metrology-Grade Accuracy with MRS Technology
-Sub-micrometer accuracy for features as small as 25 µm
-Accurately inspect shiny or mirror-like surfaces.
-Attain repeatable and reproducible measurements
- Fast, Superior Inspection Performance
-Increase throughput with the MRS sensor that is 2-3X faster than
alternate technologies, delivering greater than 25 wafers
(300mm) per hour.
-Attain 3D and 2D measurements in one pass versus multiple
-Conduct 100% 3D and 2D metrology and inspection versus
- Versatility for Wafer-Level and Advanced Packaging Applications
-Measure and inspect a wide range of semiconductor applications
including gold bumps, solder balls and bumps, wafer bumps,
copper pillars and other wafer-level and advanced packaging
-Measure and inspect critical packaging features including bump
height, coplanarity, diameter and shape, relative location and
variety of other measurements."
-The 3-micron Nano Resolution (X/Y resolution of 3micron, Z
resolution of 50 nanometer)