The Argus system is optimized for multi-layer RDL interposer structures, ensuring accurate defect detection and measurement. With its innovative optical design and advanced algorithms, Argus effectively minimizes interference from underlying layers, enabling precise identification of critical defects to meet the stringent requirements of advanced packaging.
 
Features 
Wafer Size Support: 6”, 8”, 12”. 
Wafer Thickness Range: 400-2500um.
Panel Size Support: 310x310mm.
TLI for multi-layer RDL (10P10M, L=1.4um)
Optional μBH, COP metrology (Round bump CD<8um)
Optional fluorescence inspection.
Tool matching.
Maximum die size: 285×285 mm.