Applications of
8-inch and 12-inch wafers
Incoming Quality Control (IQC) for wafers, Outgoing Quality Control (OQC) for finished products
2.5D/3D IC
Fan-out Wafer Level Packaging (FOWLP)
Fan-out Panel Level Packaging (FOPLP)

Minimum detectable defect size :
1 µm
 
Features
High-precision turret testing system
Multi-light source configuration design (BF/DF)
The fast and precise autofocus system optimizes image quality and supports complex multi-layer wafer designs.
Super large die capability (one chip on a full 12" wafer)
This multi-functional 2D measurement system can measure various critical dimensions
such as RDL CDs, Pad open CDs, and Bump Diameters.
The CAD Import Function is designed for ease of use and can significantly reduce recipe creation time.
Edge detection function (EBR function) supports various wafer products (option). 

Optional
Color Filter
High warpage wafer solutions, supporting up to ± 7mm (Option).
Multi-Die Function Wafer Applications 
OCR SEMI standard character recognition, with a recognition rate >99%.
Handheld Barcode Reader/RFID Function
Specialized AI learning achieves a rule-based accuracy rate >90%.
JDView offline verification software, which can provide Map overlay analysis.
Recipe offline editing function
Common Recipe Functionality (Recipe Server)
SEMI S2/S8 Certification
SECS/GEM Communication System
It supports automated transport systems (OHT/AGV/MGV...).

Key defects
RDL Damage
Pad Open
Short
Residue
Particle
Scratch

Key Measurement
RDL CD
Pad Open CD