Application & Features:
Designed for semiconductor facilities such as CVD, Diffusion, and Etch processes
Available in Plasma and Wet type configurations
Capacity options: 600 slm, 1000 slm, and 1500 slm
Compact system size of 1100 × 950 × 1800 mm
Average power consumption: 5 kW
System weight: 550 kg
Torch core temperature up to 3000°C
Capable of handling NF₃, SF₆, CF₄, and other PFC gases
Processing efficiency up to 99%
Optional accessories include acid gas absorption tube and nitrogen oxide absorption cylinder