Application of
Panel 700*700mm 2
FOPLP (fan-out panel level package)

Minimum detection size
1µm
 
Features
2D/2.5D Metrology
JDView
PL light
Contour Map
High-precision configuration
High-precision turret testing system
Multi-light source configuration design (BF/DF)
Fast and accurate autofocus system
High-speed 3D Full Bump Height Measurement
Multifunctional 3D Measurement System
 
Optional
Common Recipe Functionality (Recipe Server)
Multi-die module wafer applications 
Specialized AI learning achieves a rule-based accuracy rate >90%.
Color Filter
OCR SEMI standard character recognition, with a recognition rate >99%.
JDView offline verification software, which can provide Map overlay analysis.
SEMI S2/S8 Certification
Recipe offline editing function
Handheld Barcode Reader/RFID Function

Key detection/measurement
Open
Short
Nick
Protrusion
Cooper Void
Pin Hole
Cu Island
Station on die surface
Ti Remain
Foreign Material
Scratch on Copper Surface
Dry Film remain
False defect rate