Core Technology and Advantages：
Automatic 3D Inspection Algorithms
MagicAI Multi-Type Defect Training Platform
3D Image Analysis Function
HiP Combination Algorithms
PCB Back Drilling Inspection
Al Noise Denoising Technology
 
Application & Features：
For PCB back drilling, PCBA, and semiconductor IGBT inspection
Supports BGA/LGA/CSP, QFN/QFP/SOP, DIP, PoP, connectors, power modules, and more
Up to 1.4 s/FOV inspection speed
3 μm resolution for small BGA inspection
Flexible settings for different applications
Three-view imaging (XY / YZ / XZ) for easy defect analysis
MagicAI platform for automatic multi-defect detection