Wafer Size
Up to 8” (200 mm) wafer
Also supports Waffle Pack / Gel-Pack
 
Application
Flip chip die attach
Standard die bonding (die attach)
 
Features
One machine supports both flip chip and die attach; easy and fast process changeover
Standalone epoxy and bond stage
Up-look & down-look optics table for precision alignment
Supports various epoxy stamping processes
Supports normal die bonding process
Optional: flux dipping & flip chip die attach
Optional: DAF process
Optional: UV curing
Auto wafer expand
Auto substrate loader & unloader
Supports SMEMA connection
Bond arm: programmable bond force (VCM), 20–500g