CLC offers nitric acid series NiV etchants for use in wet bench and spin process machines, which can be utilized in both NiV/Cu etching processes.
 
Detail:
The BGBM (Backside Grinding, Backside Metallization) process employs a Ti/NiV/Ag stacking structure.
 
CLC offers nitric acid series NiV etchants for use in wet bench and spin process machines, which can be utilized in